Proudly North American: Fully owned and operating in Canada and USA
Our Services

Hardware Design

What We Do

From concept to volume production

PCB Layout & Design

Designing high-speed, high-density digital, analog, and RF PCBs for diverse applications.

Schematic Capture

From concept to production, we create precise schematics that drive reliable electronic hardware development.

First-Time-Right PCBs

Delivering successful first-build PCB designs with high signal accuracy and layout precision.

Software & FPGA Design

Creating embedded software and FPGA solutions alongside hardware development efforts.

Advanced PCB Analysis

Providing peer reviews, signal integrity modeling, and PDN analysis upon client request.

Manufacturing Readiness

Ensuring a smooth transition from prototyping to volume production and certification.
Our Experience

PCB Design Expertise

  • High-speed, multi-layer digital PCB designs (SMT, SMT/TH and HDI), e.g. Fibre channel FC8, FDR InfiniBand, PCIe 4.0, HDMI 2.0, SATA 2.0, XAUI, USB3.2, Thunderbolt, DisplayPort, MIPI CSI-2, 25GbE, DDR4
  • High-speed SerDes circuits up to 25GHz (single lane)
  • High-speed MIPI CSI-2 circuits for multiple cameras / images
  • Radio frequency (RF) PCB designs
  • High-speed data bus memories, e.g. DDR2/3/4/5/6, QSPI, NOR/NAND Flash, SRAM, proprietary buses
  • High-speed optical signal circuits, e.g. ROSA, TOSA and SFP28 (25Gbps)
  • High-density and high pin-count designs in advanced PCB technology, e.g. microvias, via-in-pad, ultra-fine pitch BGAs, ‘first-time-right’ and DFM methodologies
  • Any-laer HDI PCB for boards with ultra-fine and high pin-count packages
  • Low-level analog PCB designs
  • Test fixture PCBs
  • Rigid-flex PCB
  • Memory interfaces, e.g. DDR2, DDR3, DDR4
  • Mixed-signal boards requiring noise / power isolation
  • PCB Signal and Power Integrity: pre- and post-layout analysis and verification
  • Impedance-controlled, transducer-interfacing, and sensitive signal designs
  • RoHS/WEEE compliant lead-free designs
  • Transition to manufacturing for high-yield, low-cost production, and IPC class 2 and 3 PCBs
  • DFT (ICT coverage, JTAG test vector development, HALT, HASS)
  • DFx for volume production (including BIST and test fixtures)
  • Create PCB stack-ups to improve EMI/FCC issues
  • PCB design DFM analysis (pre- and post- PCB layout)
  • End-of-Life and cost-reduction redesigns